INTSUPERMAI Reflow Oven T-937M Micro-computer Control Reflow Soldering Machine with 11.4x14.76in or 12.4x14.76in Soldering Area Drawer Type lead/Lead Free Reflow Soldering Machine 110V 2300W

Parameters: Voltage: 110V Power rating: 3300W Drawer area: 350mm*400mm/13.78in*15.75in Soldering area: Lead Free Welding: 290mm*375mm/11.42in*14.76in Lead Welding: 315mm*375mm/12.4in*14.76in Cycle time: 2～16 min Temp rage: Room temp～350℃ Mode Of Heating: infrared and hot air Mode Of Controling: 8 Intelligent temperature waves heating Item included: One set of Reflow Oven T-937M Micro-computer Control Reflow Soldering Machine 4 rolls10mm×10m Heat Resistant Tape Features: This oven solder leadfree paste very well. This oven can connect with PC, easy to input/set/transmit/adjust/save/manage wave data. Many kinds wave input style in control software, easy to set wave. The control software is with graphical display, display the wave intuitively. The control software is with wave printing function, easy to save/manage/analysis the wave data. The control software is with 299 kinds of paste data inside. Adopt stable and high-speed MCU and advanced intelligent temperature measurement technology,temperature in the oven is very stable,exact and even. Add the compensation circuit, make the oven temperature keep stable from diferent environment. This oven is with hot air fan inside, to make the temperature inside more even. The temperature is room temp to 350C, suit for single/double side PCB board and lead/leadfree paste soldering. Add special exhaust on the back, provide good operation environment. Friendly human-machine operation interface, perfect LCD display, very easy to operate. Good database management function. Thermostatic timer function.

• Heating and Equalizing Design -- The output power is 110V, 4500W. It applies modes of infrared heating and hot air heating, which can make the temperature more accurate and even, and complete the whole production process automatically and accurately according to your preset temperature curve. It is equipped with a dedicated exhaust device on the back, providing a good operating environment.
• SOLDERING AREA -- This Reflow Oven is suitable for single/double side PCB board and lead/lead free paste soldering. For Lead Free Welding,the soldering area is 290x375mm/11.42x14.76in; For Lead Welding, the soldering area is 315x375mm/12.4x14.76in. Drawer Type design, the max temperature is 350℃,it also has thermostatic timer function.
• Multiple Temperature Curve Selection -- This reflow oven has has eight kinds of temperature parameter curves to choose from, and has the function of manual heating and forced cooling; It adopts the thermocouple temperature measurement and add the compensation circuit, make the temperature measurement more accurate, the wave more perfect. The whole welding process is completed automatically and the operation is simple.
• Intelligent Control -- This Reflow Soldering Machine uses PID intelligent temperature control technology; make the temperature control more accurately. Adopt the imported large current solid-state relay non-contact output can effectively avoid the IC or circuit board damage due to the rapid or uninterrupted warming up, make the whole welding process more scientific safety. It supports programming and preset function.
• Widely Application -- This micro-computer control reflow soldering machine has the functions of reflow, drying, heat preservation, shaping, rapid cooling, etc. It can complete the welding of single and double sided PCB boards in CHIP, SOP, PLCC, QFP, BGA and other packaging forms; It can be used for product glue curing, circuit board thermal aging, PCB board maintenance and other work. It is widely used in R & D and small batch production of various enterprises, companies and institutes.