Kester RF741 No-Clean Electronics Rework Flux 6cc Syringe

Designed for BGA and QFP repair. 6 CC syringe for convenient dispensing during electronic repairs.TekLine TRF741 is a high-viscosity No-Clean paste flux developed for printed circuit board rework or repair. TRF741 is effective for prototype work where a small amount of flux is needed on a specific area of a board or assembly. The high viscosity flux stays in place until soldering occurs. Excellent performance in applications requiring a flux having good thermal stability such as surface mount component or repair.It is the ideal choice for QFP or BGA rework operations. It is also well suited for use with through-hole repair operations.Residues that remain after soldering are almost colorless, leaving a visually appealing repair. The residue is safe to be left on the assembly after soldering.

• 6cc syringe contains enough flux for 15-20 BGA repairs
• High Viscosity- stays where you put it.
• Compatible with most no-clean solders and fluxes.
• Lead Free - RoHS compliant.
• 18 gauge dispensing tips as pictured for precision dispensing of flux.